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L585 数据表(PDF) 2 Page - STMicroelectronics |
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L585 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 9 page ![]() PIN CONNECTION THERMAL DATA Symbol Parameter Value Unit Rth j-amb Rth j-alumina(*) Thermal Resistance Junction-ambient (*) for DIP 16 Thermal Resistance Junction-alumina for SO-16 Max Max 80 50 °C/W °C/W ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VS Operating supply Voltage (through RS)28 V VD Dump Voltage 100 V Tj Junction Temperature Range – 40 to 150 °C Ptot Power Dissipation at Tamb =80 °C 1W Tstg Junction and Storage Temperature Range – 55 to 150 °C Top Operating Temperature Range – 40 to 125 °C No te : Soldered on PC board that simulates an application with medium device density on board. (*) Thermal resistance junction-pins with the chip soldered on the middle of an alumina supporting substrate measuring 15 ö 20 mm ; 0.65 mm thickness and infinite heathsink. (*) MUST BE LEFT FLOATING L585 2/9 |
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