ADCMP580/ADCMP581/ADCMP582

Rev. A | Page 14 of 16

OUTLINE DIMENSIONS

1

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50 REF

0.50

0.40

0.30

0.25 MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

0.90

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

3.00

BSC SQ

*1.65

1.50 SQ

1.35

16

5

13

8

9

12

4

EXPOSED

PAD

(BOTTOM VIEW)

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION.

Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad

(CP-16-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

ADCMP580BCP-WP

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G07

ADCMP580BCP–R2

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G07

ADCMP580BCP–RL7

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G07

ADCMP580BCPZ-WP1

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G12

ADCMP580BCPZ–R21

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G12

ADCMP580BCPZ–RL71

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G12

ADCMP581BCP-WP

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G09

ADCMP581BCP–R2

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G09

ADCMP581BCP–RL7

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G09

ADCMP581BCPZ-WP1

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G11

ADCMP581BCPZ–R21

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G11

ADCMP581BCPZ–RL71

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G11

ADCMP582BCP-WP

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G0B

ADCMP582BCP-R2

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G0B

ADCMP582BCP-RL7

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G0B

ADCMP582BCPZ-WP1

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G10

ADCMP582BCPZ-R21

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G10

ADCMP582BCPZ-RL71

−40°C to +125°C

16-Lead LFCSP_VQ

CP-16-3

G10

EVAL-ADCMP580BCPZ1

Evaluation Board

EVAL-ADCMP581BCPZ1

Evaluation Board

EVAL-ADCMP582BCPZ1

Evaluation Board