ADCMP563/ADCMP564

Rev. B | Page 14 of 16

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-137-AB

16

9

8

1

PIN 1

SEATING

PLANE

0.010

0.004

0.012

0.008

0.025

BSC

0.010

0.006

0.050

0.016

8°

0°

COPLANARITY

0.004

0.065

0.049

0.069

0.053

0.154

BSC

0.236

BSC

0.193

BSC

Figure 28. 16-Lead Shrink Small Outline Package [QSOP]

(RQ-16)

Dimensions shown in inches

20

11

10

1

PIN 1

8°

0°

0.236

BSC

0.154

BSC

0.010

0.004

0.012

0.008

0.025

BSC

COPLANARITY

0.004

0.065

0.049

0.069

0.053

SEATING

PLANE

0.010

0.006

0.050

0.016

0.341

BSC

COMPLIANT TO JEDEC STANDARDS MO-137-AD

Figure 29. 20-Lead Shrink Small Outline Package [QSOP]

(RQ-20)

Dimensions shown in inches

1

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50 REF

0.50

0.40

0.30

0.25 MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

0.90

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

3.00

BSC SQ

*1.65

1.50 SQ

1.35

16

5

13

8

9

12

4

EXPOSED

PAD

(BOTTOM VIEW)

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION.

Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad

(CP-16-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADCMP563BRQ

−40°C to +85°C

16-Lead QSOP

RQ-16

ADCMP563BRQZ1

−40°C to +85°C

16-Lead QSOP

RQ-16

ADCMP563BCP-R2

−40°C to +85°C

16-Lead LFCSP_VQ, 250 Unit Reel

CP-16-3

ADCMP563BCP-RL7

−40°C to +85°C

16-Lead LFCSP_VQ, 1,500 Unit Reel

CP-16-3

ADCMP563BCP-WP

−40°C to +85°C

16-Lead LFCSP_VQ, 50 Unit Waffle Pack

CP-16-3

EVAL-ADCMP563BRQ

Evaluation Board

ADCMP564BRQ

−40°C to +85°C

20-Lead QSOP

RQ-20

ADCMP564BRQZ1

−40°C to +85°C

20-Lead QSOP

RQ-20

EVAL-ADCMP564BRQ

Evaluation Board