Figure 1 : Reverse Current verus Voltage

Figure 2 : Forward Voltage versus Current

The Rth j-amb of the L6210 can be reduced by sol-

dering the GND pins to suitable copper area of the

printed circuit boards as shown in figure 3 or to an

external heatsink (figure 4). During soldering the pin

temperaturemust not exceed 260

ing time must not be longer then 12s. The external

heatsink or printed circuit copper area must be con-

nected to electrical ground.

Figure 3 : Example of P.C. Board Copper Area

which is used as Heatsink

Figure 4 : Example of an External Heatsink

MOUNTING INSTRUCTIONS

L6210

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