AD8564

Rev. B | Page 12 of 12

16

9

8

1

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 20. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD8564AN

−40°C to +125°C

16-Lead Plastic Dual In-Line Package [PDIP]

N-16

AD8564ANZ1

−40°C to +125°C

16-Lead Plastic Dual In-Line Package [PDIP]

N-16

AD8564AR

−40°C to +125°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

AD8564AR-REEL

−40°C to +125°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

AD8564AR-REEL7

−40°C to +125°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

AD8564ARZ1

−40°C to +125°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

AD8564ARZ-REEL1

−40°C to +125°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

AD8564ARZ-REEL71

−40°C to +125°C

16-Lead Standard Small Outline Package [SOIC_N]

R-16

AD8564ARU-REEL

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

AD8564ARUZ-REEL1

−40°C to +125°C

16-Lead Thin Shrink Small Outline Package [TSSOP]

RU-16

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registered trademarks are the property of their respective owners.

C01103-0-8/07(B)