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AD8606ARM-R2 数据表(PDF) 20 Page - Analog Devices |
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AD8606ARM-R2 数据表(HTML) 20 Page - Analog Devices |
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20 / 24 page ![]() AD8605/AD8606/AD8608 Rev. H | Page 20 of 24 OUTLINE DIMENSIONS SEATING PLANE 0.50 REF 0.87 0.37 0.36 0.35 0.17 0.14 0.12 0.21 0.50 0.20 0.50 0.23 0.18 0.14 BOTTOM VIEW (BALL SIDE UP) 0.94 0.90 0.86 1.33 1.29 1.25 TOP VIEW (BALL SIDE DOWN) BALL 1 IDENTIFIER A 1 2 B C Figure 57. 5-Ball Wafer Level Chip Scale Package [WLCSP] (CB-5-1) Dimensions shown in millimeters PIN 1 1.60 BSC 2.80 BSC 1.90 BSC 0.95 BSC 5 12 3 4 0.22 0.08 10° 5° 0° 0.50 0.30 0.15 MAX SEATING PLANE 1.45 MAX 1.30 1.15 0.90 2.90 BSC 0.60 0.45 0.30 COMPLIANT TO JEDEC STANDARDS MO-178-AA Figure 58. 5-Lead Small Outline Transistor Package [SOT-23] (RJ-5) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-187-AA 0.80 0.60 0.40 8° 0° 4 8 1 5 PIN 1 0.65 BSC SEATING PLANE 0.38 0.22 1.10 MAX 3.20 3.00 2.80 COPLANARITY 0.10 0.23 0.08 3.20 3.00 2.80 5.15 4.90 4.65 0.15 0.00 0.95 0.85 0.75 Figure 59. 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters |
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