AD8502/AD8504

Rev. 0 | Page 14 of 16

OUTLINE DIMENSIONS

13

5

6

2

8

4

7

2.90 BSC

1.60 BSC

1.95

BSC

0.65 BSC

0.38

0.22

0.15 MAX

1.30

1.15

0.90

SEATING

PLANE

1.45 MAX

0.22

0.08

0.60

0.45

0.30

8°

4°

0°

2.80 BSC

PIN 1

INDICATOR

COMPLIANT TO JEDEC STANDARDS MO-178-BA

Figure 40

. 8-Lead Small Outline Transistor Package [SOT-23]

(RJ-8)

Dimensions shown in millimeters

4.50

4.40

4.30

14

8

7

1

6.40

BSC

PIN 1

5.10

5.00

4.90

0.65

BSC

SEATING

PLANE

0.15

0.05

0.30

0.19

1.20

MAX

1.05

1.00

0.80

0.20

0.09

8°

0°

0.75

0.60

0.45

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB-1

Figure 41. 14-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-14)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

AD8502ARJZ-R21

−40°C to +125°C

8-Lead SOT-23

RJ-8

A1D

AD8502ARJZ-REEL1

−40°C to +125°C

8-Lead SOT-23

RJ-8

A1D

AD8502ARJZ-REEL71

−40°C to +125°C

8-Lead SOT-23

RJ-8

A1D

AD8504ARUZ1

−40°C to +125°C

14-Lead TSSOP

RU-14

AD8504ARUZ-REEL1

−40°C to +125°C

14-Lead TSSOP

RU-14