AD8317

Rev. B | Page 18 of 20

DIE INFORMATION

BOND PAD STATISTICS

ALL MEASURMENTS IN MICRONS.

MINIMUM PASSIVATION OPENING: 59 × 59 MIN PAD PITCH: 89

DIE SIZE CALCULATION

ALL MEASURMENTS IN MICRONS.

DIEX (WIDTH OF DIE IN X DIRECTION) = 670

DIEY (WIDTH OF DIE IN Y DIRECTION) = 1325

DIE THICKNESS = 305 MICRONS

BALL BOND SHEAR STRENGTH SPECIFICATION: MINIMUM 15 GRAMS

1

2

2

3

4

5

6

7

8

Y

X

DB1

Figure 39. Die Outline Dimensions

Table 6. Die Pad Function Descriptions

Pin No.

Mnemonic

Description

1

INHI

RF Input. Nominal input range of −50 dBm to 0 dBm, re: 50 Ω; ac-coupled RF input.

2, 2

COMM

Device Common. Connect both pads to a low impedance ground plane.

3

CLPF

Loop Filter Capacitor. In measurement mode, this capacitor sets the pulse response time and video

bandwidth. In controller mode, the capacitance on this node sets the response time of the error

amplifier/integrator.

4

VSET

Setpoint Control Input for Controller Mode or Feedback Input for Measurement Mode.

5

VOUT

Measurement and Controller Output. In measurement mode, VOUT provides a decreasing linear-in dB

representation of the RF input signal amplitude. In controller mode, VOUT is used to control the gain of

a VGA or VVA with a positive gain sense (increasing voltage increases gain).

6

TADJ

Temperature Compensation Adjustment. Frequency-dependent temperature compensation is set by

connecting a ground-referenced resistor to this pin.

7

VPOS

Positive Supply Voltage: 3.0 V to 5.5 V.

8

INLO

RF Common for INHI. AC-coupled RF common.

DB1

COMM

Device Common. Connect to a low impedance ground plane.