Metal Foil on Ceramic Chip Resistors

MFC Series

10.20

General Note

TT Electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

© TT Electronics plc

www.ttelectronics.com/resistors

BI Technologies IRC Welwyn

Mounting Recommendations

Size

Resistance Value

L

a

b

0402

10- 50

0.5

0.6

0.5

0603

3- 4

0.4

1

1.2

5- 9

0.6

1.1

10- 100

0.5

0.9

1

0805

3- 4

0.5

1.4

1.35

5- 9

0.8

1.2

10- 100

1.3

1.3

1206

3- 4

0.8

1.8

1.8

5- 9

1.8

1.3

10- 100

1.5

1.7

1.4

2010

3- 9

1.6

2.9

2.4

10- 100

2.7

1.8

2512

2- 4

1

3.4

3.5

5- 200

3.8

2.1

Packaging

MFC0402 is packed on 8mm paper tape at 2mm component pitch. MFC0603, 0805 & 1206 are packed on 8mm paper tape at 4mm component pitch.

MFC2010 & 2512 are packed on 12mm plastic tape at 4mm component pitch. All sizes are on 178mm diameter reels.

Low Resistance Metal Alloy Resistor

LRMA Series

Temperature Derating

0%

20%

40%

60%

80%

100%

-30

20

70

120

170

Ambient Temperature (°C)

Typical Temperature Rise

0

20

40

60

80

100

120

0%

20%

40%

60%

80%

100%

Proportion of Pr

Joint

Hot spot

Construction

Marking

The components are marked with ohmic value, e.g. “R002” = 2mΩ, “R010” = 10 mΩ.

Solvent Resistance

The

Due to space restrictions, for LRMAM1206-R001, "01" = 1mΩ is used, and for LRMAM0805,

“2” = 2mΩ, “010” = 10 mΩ are used.

component is resistant to all normal industrial cleaning solvents suitable for printed circuits.

Performance Data

Maximum (%)

Typical (%)

Load at rated power (cyclic load, 1000 hours at 70°C)

±∆R

0805: 1.5 Others 1

0805: 1 Others 0.5

0805: 1 Others 0.5

0805: 1.5 Others 0.5

0805: 1 Others 0.5

0.3

Short term overload (5 x rated power for 5s)

±∆R

0.5

0.15

Humidity (1000 hours, 85°C, 85%RH)

±∆R

0.15

Temperature cycle (-40 to +125°C, 1000 cycles, 15 minute dwell)

±∆R

0.15

Resistance to solder heat (260°C ±5°C for 20s ±1s)

±∆R

0.5

0.3

Solderability (245°C ±5°C for 2s ±0.5s)

>95% coverage

Dry heat (1000 hours at 170°C)

±∆R

0.3

Low temperature storage (1000 hours at -55°C)

±∆R

0.5

0.15

Substrate bending (board 1.6mm, fulcrum spacing 90mm, deflection 2mm)

±∆R

0.3

Insulation resistance (1 minute @ 100Vdc)

>100M

Thermal Performance & Mounting

Copper electrode with

nickel then tin plating

Coating (UL94-V0)

Low TCR

resistance alloy plate

The temperature rise shown is highly

dependent on mounting conditions.

Reference conditions assume 20

copper with thermal vias to multiple

layers.

The self-heating in the current tracks

should be kept negligible, or allowed

for by temperature derating.

Sense

Current

L

b

a

Standard 4-terminal probe pitches for measuring unmounted parts are 2.8 x 1.7mm (0612), 0.4 x 1.83mm (0805),

0.4 x 2.8mm (1206), 1.2 x 4.5mm (2010), 1.5 x 5.8mm (2512), and 5.4 x 3.4mm (1225). All probe location tolerances

±0.02mm.

Reference Pad Dimensions (mm)

Size

a

b

L

1206

1.8

1.8

1.7

2.3

1.6

1.0

1.4

3.8

0.7

0.7

1.2

1.15

3.4

3.5

1.5

0815

2010

0805

0612

7.9

1.5

0.9

2512 ≤R0031

<R002

1206 ≥R002

4.0

3.1

1.3

2512 >R0031

4.0

2.1

4.1

1225

7.0

1.0

2.3

Note 1 - This applies to LRMAT2512 and LRMAM2512. For LRMAP2512 this threshold is R004

General Note

TT Electronics reserves the right to make changes in product specifica�on without no�ce or liability.

All informa�on is subject to TT Electronics’ own data and is considered accurate at �me of going to print.

BI Technologies IRC Welwyn

h�ps://www.�electronics.com/resistors

© TT Electronics plc

Metal Foil on Ceramic

Chip Resistors

MFC Series

Resistors

Moun�ng Recommenda�ons

Size

Resistance Value

L

a

b

0402

10 - 50

0.5

0.6

0.5

0603

3 - 4

0.4

1

1.2

5 - 9

0.6

1.1

10 - 100

0.5

0.9

1

0805

3 - 4

0.5

1.4

1.35

5 - 9

0.8

1.2

10 - 100

1.3

1.3

1206

3 - 4

0.8

1.8

1.8

5 - 9

1.8

1.3

10 - 100

1.5

1.7

1.4

2010

3 - 9

1.6

2.9

2.4

10 - 100

2.7

1.8

2512

2 - 4

1

3.4

3.5

5 - 200

3.8

2.1

Packaging

MFC0402 is packed on 8mm paper tape at 2mm component pitch. MFC0603, 0805 & 1206 are packed on 8mm paper tape at 4mm component

pitch. MFC2010 & 2512 are packed on 12mm plas�c tape at 4mm component pitch. All sizes are on 178mm diameter reels.

Ordering Procedure

Example: MFC0603-R005FT5 (0603, 5 milliohms ±1%, Pb-free)

M F

C

0

6

0

3

-

R

0

0

5

F

T

5

1

2

3

4

5

1

2

3

4

5

Type Size

Value

Tolerance

Packing

MFC 0402

E24

3/4 characters

R = ohms

D = ±0.5% T10

0402

10,000/reel

0603

F = ±1%

T5 0603 to 1206 5000/reel

0805

T4

2010, 2512

4000/reel

1206

2010

2512

USE SAME IMAGE AS ON LRMA

J =

G = ±2%

±5%