THERMAL CHARACTERISTICS

The cooling of the device is obtained by soldering

its ground pins on a proper p.c.b copper side ,

acting as a true heatsink. By considering four

squared side as in Fig.10, the junction to ambient

thermal resistance has been measured (see

Fig.11). The typical transient thermal resistance

versus values of single pulse width of power is

shown in Fig.12. In general these thermal charac-

teristics are very important to the designer to opti-

mize the L6285 applications.

Figure 10: Four ”on board” Square Heatsink

Figure 12: Typical Transient Thermal Resistance

vs. Time or Pulse Width

L6285

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