2

FN1547.8

October 29, 2007

Ordering Information

PART NUMBER

PART MARKING

TEMP RANGE (°C)

PACKAGE

PKG DWG. #

CDP68HC68T1E

CDP68HC68T1E

-40 to +85

16 Ld PDIP

E16.3

CDP68HC68T1EZ (Note)

CDP68HC68T1EZ

-40 to +85

16 Ld PDIP**

(Pb-free)

E16.3

CDP68HC68T1M*

68HC68T1M

-40 to +85

20 Ld SOIC

Tape and Reel

M20.3

CDP68HC68T1MZ* (Note)

68HC68T1MZ

-40 to +85

20 Ld SOIC (Pb-free)

Tape and Reel

M20.3

CDP68HC68T1M2*

HC68T1M2

-40 to +85

16 Ld SOIC

Tape and Reel

M16.3

CDP68HC68T1M2Z* (Note)

HC68T1M2Z

-40 to +85

16 Ld SOIC (Pb-free)

Tape and Reel

M16.3

*Add “96” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%

matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.

Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J

STD-020.

CDP68HC68T1