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IS25LP016D-RMLA3 数据表(PDF) 6 Page - Integrated Silicon Solution, Inc |
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IS25LP016D-RMLA3 数据表(HTML) 6 Page - Integrated Silicon Solution, Inc |
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6 / 115 page ![]() IS25LP016D IS25WP016D Integrated Silicon Solution, Inc.- www.issi.com 6 Rev. B16 01/01/2025 10.4 8-Contact Ultra-Thin Small Outline No-Lead (USON) Package 2x3mm (U) ......................................106 10.5 8-Contact Ultra-Thin Small Outline No-Lead (USON) Package 4x3mm (T).......................................107 10.6 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 6x5mm (K)......................................108 10.7 16-Pin JEDEC 300mil Small Outline Integrated Circuit (SOIC) Package (M) ....................................109 10.8 24-Ball Thin Profile Fine Pitch BGA 6x8mm 4x6 array (G).................................................................110 10.9 24-Ball Thin Profile Fine Pitch BGA 6x8mm 5x5 array (H).................................................................111 10.10 8-CONTACT ULTRA-THIN SMALL OUTLINE NO-LEAD (WSON) PACKAGE 8x6mm (L).............112 11. ORDERING INFORMATION - Valid Part Numbers...............................................................................113 |
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