THERMAL CHARACTERISTICS

DIP16+2+2. The thermal resistance is re-

ferred to the thermal path from the dissipat-

ing region on the top surface of the silicon

chip, to the points along the four central pins

of the package, at a distance of 1.5 mm

away from the stand-offs.

If a dissipating surface, thick at least 35

µm,

and with a surface similar or bigger than the

one shown, is created making use of the

printed circuit.

Such heatsinking surface is considered on

the bottom side of an horizontal PCB (worst

case).

If the power dissipating pins (the four central

ones), as well as the others, have a mini-

mum thermal connection with the external

world (very thin strips only) so that the dissi-

pation takes place through still air and

through the PCB itself.

It is the same situation of point above, with-

out any heatsinking surface created on pur-

pose on the board.

Additional data on the PowerDip and the

PowerSO20 package can be found in:

Application Note AN467:

Thermal Characteristics of the PowerDip

20,24 Packages Soldered on 1,2,3 oz.

Copper PCB

Application Note AN668:

A New High Power IC Surface Mount Pack-

age: PowerSO20 Power IC Packaging from

Insertion to Surface Mounting.

THERMAL DATA

Symbol

Parameter

DIP16+2+2

PowerSO20

Unit

Thermal Resistance, Junction to Pin

12

–

°C/W

Thermal Resistance, Junction to Ambient

(see Thermal Characteristics)

40

–

°C/W

Thermal Resistance, Junction to Ambient (see Thermal

Characteristics)

50

–

°C/W

Thermal Residance Junction-case

–

1.5

°C/W

Figure 1: Printed Heatsink

L6376

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