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WILCS02PE 数据表(PDF) 51 Page - Microchip Technology |
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WILCS02PE 数据表(HTML) 51 Page - Microchip Technology |
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51 / 71 page ![]() WILCS02IC and WILCS02 Family Packaging Information Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005557C - 51 4. Packaging Information This chapter provides information on package markings, dimension and footprint of the WILCS02IC and the WILCS02 Module. 4.1 WILCS02IC Packaging Information For the most current package drawings, see the Microchip Packaging Specification available at www.microchip.com/en-us/support/package-drawings. 4.1.1 WILCS02IC Package Marking Figure 4-1. WILCS02IC Package Marking 48L VQFN 7x7x0.9 mm Example Legend: XX...X Customer-specific informa�on Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week '01') NNN Alphanumeric traceability code Pb-free JEDEC designator for Ma�e Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limi�ng the number of available characters for customer-specific informa�on. 4.1.2 WILCS02IC Packaging Dimension This section provides the package dimension details of WILCS02IC. |
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