General data

Operate time at U

Reset time (latching) at U

Release time without diode in parallel (non-latching), typ. / max.

Release time with diode in parallel (non-latching), typ. / max.

Bounce time at closing contact, typ. / max.

Maximum switching rate without load

Ambient temperature

Thermal resistance

Maximum permissible coil temperature

Vibration resistance (function)

Shock resistance, half sinus, 11 ms

half sinus, 0.5 ms

Degree of protection / Environmental protection

Needle flame test

Mounting position

Processing information

Weight (mass)

Terminal surface

Moisture sensitive level (JEDEC J-STD-020B)

Resistance to soldering heat

1 ms / 3 ms

1 ms /3 ms

1 ms / 3 ms

3 ms / 5 ms

1 ms / 5 ms

50 operations/s

-40° C ... +85° C

< 150 K/W

125° C

20 G

10 to 1000 Hz

50 G (function)

500 G (damage)

immersion cleanable, IP 67 / RT V

application time 20 s, no burning and glowing

any

Ultrasonic cleaning is not recommended

max. 0.75 g

NiPdAu

MSL 3

260° C / 10 s

IM Relay

All data refers to 23° C unless otherwise specified.

Page 8 (11)

108-98001 Rev. D

Recommended soldering conditions

Soldering conditions according IEC 60058-2-58 and

IPC/JEDEC J-STD-020B

Vapor Phase Soldering: Temperature/Time Profile

(Lead and Housing Peak Temperature)

Infrared Soldering: Temperature/Time Profile

(Lead and Housing Peak Temperature)

240° C

180° C

130° C

100° C

20 - 40 sec

Full line:

typical

Dotted line: process limits

forced

cooling

Time (s)

Time (s)

Resistance to soldering heat - Reflow profile

Recommended reflow soldering profile

Infrared Soldering: Temperature/Time Profile

(Lead and Housing Peak Temperature)

Time (s)