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STPS30L45CFP 数据表(PDF) 5 Page - STMicroelectronics |
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STPS30L45CFP 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 12 page ![]() STPS30L45C Characteristics Doc ID 8002 Rev 4 5/12 Figure 11. Forward voltage drop versus forward current (maximum values, per diode) Figure 12. Thermal resistance junction to ambient versus copper surface under tab for D2PAK 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 1 10 100 200 VFM(V) IFM(A) Typical values Tj=150°C Tj=25°C Tj=125°C 0 5 10 15 20 25 30 35 40 0 10 20 30 40 50 60 70 80 S(cm²) Rth(j-a) (°C/W) Epoxy printed circuit board FP4, copper thickness = 35 µm |
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