Characteristics

STPS30L30C

4/9

Doc ID 5506 Rev 6

Figure 12.

Reverse safe operating area (tp < 1 µs and Tj < 150 °C)

Figure 8.

Reverse leakage current versus

reverse voltage applied (typical

values per diode)

Figure 9.

Junction capacitance versus

reverse voltage applied

(typical values per diode)

0

5

10

15

20

25

30

1E-2

1E-1

1E+0

1E+1

1E+2

1E+3

VR(V)

IR(mA)

Tj=125°C

Tj=25°C

Tj=150°C

12

5

10

20

50

0.1

1.0

5.0

VR(V)

C(nF)

F=1MHz

Tj=25°C

Figure 10.

Forward voltage drop versus

forward current (maximum values

per diode)

Figure 11.

Thermal resistance junction to

ambient versus copper surface

under tab

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1

10

100

200

VFM(V)

IFM(A)

Tj=15 0 °C

(typical values)

Tj=12 5 °C

Tj=25 °C

0

4

8

12

16

20

24

28

32

36

40

0

10

20

30

40

50

60

70

80

S(Cu) (cm²)

Rth(j-a) (°C/W)

Epoxy printed circuit board,

D2PAK

copper thickness = 35 µm

20

25

30

35

40

45

50

55

30

35

40

45

50

55

60

Forbidden area

Operating area

Varm (V)

Iarm (A)