| 数据搜索系统,热门电子元器件搜索 |
|
LM3520SD 数据表(PDF) 13 Page - National Semiconductor (TI) |
|
|
|
|||||||||||||||||||||||||||||
LM3520SD 数据表(HTML) 13 Page - National Semiconductor (TI) |
|
13 / 14 page ![]() Application Information (Continued) tor is sufficient for the main-display. A minimum of 4.7µF output capacitor is recommended for V SUB output. Larger output capacitor can be used to reduce ripple voltage. The LM3520 has a maximum OVP of 24.2V, a 25V minimum rated capacitor voltage is recommended for the application to ensure proper biasing. Local bypassing for the input is needed on LM3520. Multi- layer ceramic capacitors with low ESR are a good choice for this as well. A 10 µF capacitor is sufficient for most applica- tions. Using larger capacitance decreases input voltage ripple on the input. Extra attention is required if smaller case size capacitor is used in the application. Smaller case size capacitor typically has less capacitance for a given bias voltage as compared to a larger case size capacitor with the same bias voltage. Please contact the capacitor manufac- turer for detail information regarding capacitance verses case size. Table 3 lists several capacitor suppliers. TABLE 3. Suppliers Website TDK www.tdk.com AVX www.avxcorp.com Murata www.murata.com LAYOUT CONSIDERATIONS As for any high frequency switcher, it is important to place the external components as close as possible to the IC to maximize device performance. Below are some layout rec- ommendations: 1) Place input filter and output filter capaci- tors close to the IC to minimize copper trace resistance which will directly effect the overall ripple voltage. 2) Place the feedback network resistors in the Main and Sub display close to the IC. 3) Route noise sensitive trace away from noisy power components. 4) Connect the ground pins and filter capacitors together via a ground plane to prevent switching current circulating through the ground plane. Simi- larly the ground connection for the feedback network should tie directly to GND plane. If no ground plan is available, the ground connections should tie directly to the device GND pin. Additional layout consideration regarding the LLP pack- age can be found in Application AN1187 www.national.com 13 |
|
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |