VDD, CPVDD to SGND ...........................................-0.3V to +6V

VSS, CPVSS to SGND............................................+0.3V to -6V

VDD to CPVDD.....................................................-0.3V to +0.3V

VSS to CPVSS......................................................-0.3V to +0.3V

SHDN, DIAG to SGND............................. -0.3V to (VDD + 0.3V)

OUT_ to PGND ...................................(VCPVSS - 0.3V) to +45V

IN_ to SGND (MAX13330) ............(VSS - 0.3V) to (VDD + 0.3V)

IN_ to SGND (MAX13331) ....................... -0.3V to (VDD + 0.3V)

C1P to PGND.....................................-0.3V to (VCPVDD + 0.3V)

C1N to PGND............................................(VSS - 0.3V) to +0.3V

Output Short-Circuit Duration....................................Continuous

Continuous Power Dissipation (TA = +70°C)

QSOP (derate 9.6mW/°C above +70°C)).................771.5mW

Operating Temperature Range......................... -40°C to +105°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).......................................+260°C

(Note 1)

(VDD = VCPVDD = +5V, VSGND = VPGND = 0V, SHDN = VDD, C1 = C2 = 1μF, RL = ∞, resistive load referenced to ground, for

MAX13330 gain = -1.5V/V (internally set), for MAX13331 gain = -1.5V/V (RIN = 30kΩ, RFB = 45kΩ), TA = TJ = -40°C to +105°C, unless

otherwise noted. Typical values are at TA = +25°C, unless otherwise noted.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

GENERAL

Amplifier Supply Voltage Range

VDD

4.0

5.5

V

Charge-Pump Supply Voltage

Range

VCPVDD

4.0

5.5

V

Charge-Pump Output Voltage

VCPVSS

-VDD

V

Quiescent Supply Current

IDD

RL = ∞

10

mA

Shutdown Supply Current

ISHDN

10

µA

SHDN Input-Logic High

VIH

2

V

SHDN Input-Logic Low

VIL

0.8

V

SHDN Input Leakage Current

-1

+1

µA

SHDN to Full Operation Time

tSON

100

µs

DIAGNOSTICS

Diagnostic Output Voltage

VDIAG

RDIAG = ∞,

TA = +25°C

No fault

0.02 x

VDD

V

OUTR short to

SGND

0.22 x

VDD

0.25 x

VDD

0.28 x

VDD

OUTL short to

SGND

0.47 x

VDD

0.50 x

VDD

0.53 x

VDD

OUTR short to

VBAT

0.72 x

VDD

0.75 x

VDD

0.78 x

VDD

OUTL short to

VBAT

0.97 x

VDD

MAX13330/MAX13331

Automotive DirectDrive Headphone Amplifiers

with Output Protection and Diagnostics

www.maximintegrated.com

Maxim Integrated │ 2

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Electrical Characteristics

QSOP

Junction-to-Ambient Thermal Resistance (θJA) .....103.7°C/W

Junction-to-Case Thermal Resistance (θJC)...............37°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Package Thermal Characteristics