VCC to GND ............................................................-0.3V to +6V

RS+, RS- to GND (VCC = 5V)................................-30V to +80V

RS+, RS- to GND (VCC = 0V)...........-15V to +80V (15 minutes)

Differential Input Voltage (VRS+ - VRS-)

(MAX9918/MAX9919)................................±15V (Continuous)

Differential Input Voltage

(VRS+ - VRS-) (MAX9920)...........................±5V (Continuous)

REFIN, FB, OUT to GND ......................... -0.3V to (VCC + 0.3V)

SHDN to GND .......................................................-0.3V to +20V

Output Short Circuit to VCC or GND .........................Continuous

Continuous Current into Any Pin

(Not to exceed package power dissipation) .................±20mA

Continuous Power Dissipation (TA = +70°C)

8-Pin SO-EP (derate 24.4mW/°C above +70°C) .. 1951.2mW**

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).......................................+260°C

SO-EP

Junction-to-Ambient Thermal Resistance (θJA) ..........41°C/W

Junction-to-Case Thermal Resistance (θJC).................7°C/W

**As per JEDEC51 Standard (multilayer board).

(Note 1)

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

8 SO-EP

PACKAGE CODE

S8E+14

Outline Number

21-0111

Land Pattern Number

90-0151

Thermal Resistance, Single-Layer Board:

Junction to Ambient (θJA)

52°C/W

Junction to Case (θJC)

6°C/W

Thermal Resistance, Four-Layer Board:

Junction to Ambient (θJA)

41°C/W

Junction to Case (θJC)

7°C/W

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

For the latest package outline information and land patterns (footprints), go to

www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Package Information

www.maximintegrated.com

Maxim Integrated │ 2

MAX9918/MAX9919/MAX9920

-20V to +75V Input Range,

Precision Uni-/Bidirectional,

Current-Sense Amplifiers