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数据搜索系统，热门电子元器件搜索 |
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STM32L4P5CEU6P 数据表(PDF) 303 Page - STMicroelectronics |
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STM32L4P5CEU6P 数据表(HTML) 303 Page - STMicroelectronics |
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303 / 311 page  DS12903 Rev 2 303/311 STM32L4P5xx Package information 307 Figure 101. UFBGA169 recommended footprint Note: Non-solder mask defined (NSMD) pads are recommended. Note: 4 to 6 mils solder paste screen printing process. ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 134. UFBGA169 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 mm Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 133. UFBGA169 mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. MS18965V2 Dsm Dpad |
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