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MAX40009 数据表(PDF) 3 Page - Analog Devices

部件名 MAX40009
功能描述  220ns, 12μA, 6-Bump WLP Comparators with Shutdown
PDF  14 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

MAX40009 数据表(HTML) 3 Page - Analog Devices

  MAX40009 Datasheet HTML 1Page - Analog Devices MAX40009 Datasheet HTML 2Page - Analog Devices MAX40009 Datasheet HTML 3Page - Analog Devices MAX40009 Datasheet HTML 4Page - Analog Devices MAX40009 Datasheet HTML 5Page - Analog Devices MAX40009 Datasheet HTML 6Page - Analog Devices MAX40009 Datasheet HTML 7Page - Analog Devices MAX40009 Datasheet HTML 8Page - Analog Devices MAX40009 Datasheet HTML 9Page - Analog Devices Next Button
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VDD to GND ............................................................-0.3V to +6V
IN+, IN-, SHDN to GND ..........................................-0.3V to +6V
IN+ to IN-...............................................................................±6V
OUT(MAX40008) to GND........................................-0.3V to +6V
OUT(MAX40009) to GND............................-0.3V to VDD + 0.3V
OUT Short-Circuit to VDD or GND Duration.......................... 10s
Continuous Current Into Any Input Pin...............................20mA
Continuous Current Into/Out of Any Output Pin.................50mA
Maximum Power Dissipation.......................................................
WLP-6, Derate 10.2mW/°C Above +70°C...................816mW
SOT23-6, Derate 4.3mW/°C Above +70°C ..............347.8mW
Operating Temperature Range......................... -40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range............................ -65°C to +150°C
Lead Temperature (Soldering, 10s).................................+300°C
6-WLP
PACKAGE CODE
N60D1+1
Outline Number
21-100086
Land Pattern Number
Refer to
Application Note 1891
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA)
98°C/W
Junction to Case (θJC)
6-SOT23
PACKAGE CODE
U6+1
Outline Number
21-0058
Land Pattern Number
90-0175
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA)
230°C/W
Junction to Case (θJC)
76°C/W
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package Information
www.analog.com
Analog Devices │ 3
MAX40008/MAX40009
220ns, 12μA, 6-Bump WLP
Comparators with Shutdown



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