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MAX40009 数据表(PDF) 3 Page - Analog Devices |
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MAX40009 数据表(HTML) 3 Page - Analog Devices |
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3 / 14 page ![]() VDD to GND ............................................................-0.3V to +6V IN+, IN-, SHDN to GND ..........................................-0.3V to +6V IN+ to IN-...............................................................................±6V OUT(MAX40008) to GND........................................-0.3V to +6V OUT(MAX40009) to GND............................-0.3V to VDD + 0.3V OUT Short-Circuit to VDD or GND Duration.......................... 10s Continuous Current Into Any Input Pin...............................20mA Continuous Current Into/Out of Any Output Pin.................50mA Maximum Power Dissipation....................................................... WLP-6, Derate 10.2mW/°C Above +70°C...................816mW SOT23-6, Derate 4.3mW/°C Above +70°C ..............347.8mW Operating Temperature Range......................... -40°C to +125°C Junction Temperature......................................................+150°C Storage Temperature Range............................ -65°C to +150°C Lead Temperature (Soldering, 10s).................................+300°C 6-WLP PACKAGE CODE N60D1+1 Outline Number 21-100086 Land Pattern Number Refer to Application Note 1891 Thermal Resistance, Four-Layer Board: Junction to Ambient (θJA) 98°C/W Junction to Case (θJC) 6-SOT23 PACKAGE CODE U6+1 Outline Number 21-0058 Land Pattern Number 90-0175 Thermal Resistance, Four-Layer Board: Junction to Ambient (θJA) 230°C/W Junction to Case (θJC) 76°C/W Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package Information www.analog.com Analog Devices │ 3 MAX40008/MAX40009 220ns, 12μA, 6-Bump WLP Comparators with Shutdown |
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