| 数据搜索系统,热门电子元器件搜索 |
|
LXK2-PWN2-R00 数据表(PDF) 14 Page - Lumileds Lighting Company |
|
|
|||||||||||||||||||||||||||||
LXK2-PWN2-R00 数据表(HTML) 14 Page - Lumileds Lighting Company |
|
14 / 41 page ![]() 14 LUXEON K2 Datasheet DS51 (7/07) Solder Pad Design—SMT Lead Form Notes for Figure 2: 1. Electrical isolation is required between signal leads and hexagonal heat slug contact. 2. For optimal thermal performance, maximize board metallization at hexagonal heat slug contact. Solder Pad Layout—SMT Lead Form Pin Out Diagram Figure 2. 4Lead Gullwing Solder Pad Design. Figure 3. 4Lead Gullwing Package Solder Pad Layout. Conductive Pad Conductive Pad Soldermask Package Outline Conductive Pad Figure 4. 4Lead Gullwing Pin Out Diagram. |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |