Use

Material

Cd

CrVl

Pb

Hg

PBB

PBDE

Ref #

Device

CHIP

<1

<1

<1

<1

<1

<1

1000

COMPOUND

<2

<2

<2

<2

<100

<100

637

EPOXY

<2

<5

<5

<1

<10

<10

32

EXTLF

<2

<2

149000

<2

NA

NA

56

FRAME

<2

<2

15

<2

NA

NA

53

WIRE

<2

<5

<5

<1

<10

<10

75

Ref #

1000

Analysis on 04/17/2007 by Balazs Analytical Services-Freemont CA per Report# 07-01051-07

32

Analysis on 05/16/2007 by ALS per Report# ATJB/3488BS/2007

53

Analysis on 03/13/2007 by SGS per Report# LPCI/05143/07

56

Analysis on 04/27/2007 by SGS per Report# LPCI/07440/07

75

Analysis on 05/16/2007 by ALS per Report# ATJB/3490BS/2007

637

Analysis on 06/04/2007 by SGS per Report# LPCI/10324/07

Banned Substance Monitoring

* Unless otherwise noted, units are in PPM (parts-per-million)

* Cd: Cadmium, CrVI: Hexavalent Chromium, Pb: Lead, Hg: Mercury, ND: Not Detected

3rd Party Analysis (available upon request, subject to a non-disclosure agreement)

Document Date

29-Dec-2007

Part Number

TL082CMX

Contains Lead(Pb) and is NOT European RoHS Compliant.

NOT China RoHS Compliant

National Semiconductor

Page 2 of 3