Preliminary

TMPA2155DM

Rev.1.0

December 24, 2007

Copyright ©2005, Tai-1 Microelectronics Corp.

2

TOP VIEW

（Please email david@taimec.com.tw for complete datasheet.）

Tai-1 Microelectronics reserves the right to make corrections, modifications, enhancements, improvements, and other changes

to its products and services at any time and to discontinue any product or service without notice. Customers are responsible

for their products and applications using Tai-1 Microelectronics components.

Note that the external components or PCB layout should be designed not to generate abnormal

voltages to the chip to prevent from latch up which may cause damage to the device.

Typical Application

S1

switch

C7

470uF(6.3V)

C5

1uF(6.3V)

L1

33uH

1

8

2

7

3

6

4

5

VO+

GND

IN+

IN-

Vo-

VDD

VDDA

SDNB

JP1

2155DM

C6

1uF(6.3V)

L2

33uH

IN1-

IN1+

SDNB

R4

Ri

R5

Ri

VDD

VO+

VO-

R2

100

J1

PHONEJACKSTEREO

R6

10K

C1

1uF(6.3V)

C2

1uF(6.3V)

R1

0

C4

1uF(6.3V)

R3

100

C3

C8

1uF(6.3V)

C9

470pF(6.3V)

ABSOLUTE MAXIMUM RATINGS

Over operating free-air temperature range unless otherwise noted(1)

In normal mode

-0.3V to 6V

V

In shutdown mode

-0.3V to 7V

V

V

Continuous total power dissipation

See package dissipation ratings

-20 to 85

。C

-20 to 150

。C

-40 to 150

。C

(1) Stresses beyond those listed under”absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions “is

not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.