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STPS2L60 数据表(PDF) 4 Page - STMicroelectronics |
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STPS2L60 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 6 page ![]() STPS2L60 4/6 Figure 11: Forward voltage drop versus forward current (maximum values, low level) Figure 12: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMA) Figure 13: Thermal resistance versus lead length (DO-41) I (A) FM 0 1 2 3 4 5 6 7 8 9 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 V (V) FM T =25°C (maximum values) j T =125°C (maximum values) j T =125°C (typical values) j R (°C/W) th(j-) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 S(Cu)(cm²) R (°C/W) th Rth(j-I) 0 20 40 60 80 100 120 5 10152025 Rth(j-a) L (mm) leads |
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