EMIF08-1502M16

Ordering information

9/10

4.5

Reflow profile

Figure 14.

ST ECOPACK® recommended soldering reflow profile for PCB mounting

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

5

Ordering information

6

Revision history

0

01

2345

67

Time (min)

Temperature (°C)

2°C/s recommended

6°C/s max

220°C

125 °C

260°C max

255°C

180°C

90 sec max

10-30 sec

90 to 150 sec

3°C/s max

0

01

2345

67

Time (min)

Temperature (°C)

2°C/s recommended

6°C/s max

220°C

125 °C

260°C max

255°C

180°C

90 sec max

10-30 sec

90 to 150 sec

3°C/s max

Table 4.

Ordering information

Order code

Marking

Package

Weight

Base qty

Delivery mode

EMIF08-1502M16

1.

The marking can be rotated by 90° to differentiate assembly location

Micro QFN

7.2 mg

3000

Tape and reel (7”)

Table 5.

Document revision history

Date

Revision

Changes

24-Oct-2006

1

Initial release.

04-Feb-2008

2

Reformatted to current standards. Updated ECOPACK statement.

Added Section 4: Recommendation on PCB assembly.