STPS340U/S/B

3/7

1E-3

1E-2

1E-1

1E+0

0

1

2

3

4

5

6

7

8

9

10

t(s)

IM(A)

Ta=25°C

Ta=50°C

Ta=100°C

t

δ=0.5

Fig. 5-1: Non repetitive surge peak forward current

versus overload duration (SMB)(Maximum values).

1.0E-2

1.0E-1

1.0E+0

1.0E+1

1.0E+2

1.0E+3

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

tp(s)

Zth(j-a)/Rth(j-a)

Printed circuit board (e=35µm)

T

tp

Single pulse

δ = 0.1

δ = 0.2

δ = 0.5

Fig. 6-1: Relative variation of thermal transient

impedance junction to lead versus pulse duration

(SMB).

1E-3

1E-2

1E-1

1E+0

0

2

4

6

8

10

12

Ta=25°C

Ta=50°C

Ta=100°C

t(s)

IM(A)

t

δ=0.5

Fig. 5-2: Non repetitive surge peak forward current

versus overload duration (SMC) (Maximum values).

1E-3

1E-2

1E-1

1E+0

0

10

20

30

40

50

Tc=25°C

Tc=50°C

Tc=100°C

t(s)

IM(A)

t

δ=0.5

Fig. 5-3: Non repetitive surge peak forward current

versus overload duration (DPAK) (Maximum

values).

1.0E-2

1.0E-1

1.0E+0

1.0E+1

1.0E+2

1.0E+3

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

tp(s)

Zth(j-a)/Rth(j-a)

T

tp

Printed circuit board (e=35µm)

Single pulse

δ = 0.1

δ = 0.2

δ = 0.5

Fig. 6-2: Relative variation of thermal transient

impedance junction to lead versus pulse duration

(SMC).

1E-3

1E-2

1E-1

1E+0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

tp(s)

Zth(j-a)/Rth(j-a)

T

tp

Printed circuit board (e=35µm)

Single pulse

δ = 0.1

δ = 0.2

δ = 0.5

Fig. 6-3: Relative variation of thermal transient

impedance

junction

to

lead

versus

pulse

duration(DPAK).