MF1ICS7001 datasheet(2/7 Pages) PHILIPS

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MF1ICS7001 数据表(PDF) 2 Page - NXP Semiconductors

部件名	MF1ICS7001

功能描述	Standard 4Kbyte card IC sawn wafer on UV-tape addendum

PDF	7 Pages

Scroll/Zoom	100%

制造商	PHILIPS [NXP Semiconductors]

网页	http://www.nxp.com

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MF1ICS7001 数据表(HTML) 2 Page - NXP Semiconductors

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101731

Product data sheet

Rev. 3.1 — 18 April 2007

2 of 7

NXP Semiconductors

MF1 IC S70 01

Standard 4Kbyte card IC

3.4 Passivation

• Type:

sandwich structure

• Material:

PSG / Nitride(on top)

• Thickness:

500 nm / 600 nm

3.5 Bond pads

• Pad size:

– LA,LB

118

× 118 µm1

– TESTIO

× 110 µm2

– VSS

108

× 108 µm2

• Material:

Al-Cu

• Thickness:

0.85

µm

Remark: Substrate is connected to VSS.

1.Passivation window: 90 x 90 µm

2. Pads VSS and TESTIO are disconnected when wafer is sawn.

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