Overview

VD6725

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Overview

Figure 1.

VD6725 block diagram

Wafer level package: TSV (through-silicon via)

The wafer-level package, TSV (through-silicon via) technology, is used to design smaller

camera modules, improve the assembly yield and lower costs. The VD6725 is available in

ST’s revolutionary TSV package:

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Ultra-scaled down camera module size

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No wire bonding inside the camera module: save up to 1.6 mm in X and Y

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No substrate in the module: directly reflowable, on phone mother board or flex-attach

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Up to 400 µm saved in module Z height

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No leads on the package sides for an increased reliability and ESD protection

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Ordering information

Table 1.

Ordering information

Order code

Description

VD6725/SW

Tested, sawn dice on reconstructed wafer.