3

IXDN404 / IXDI404 / IXDF404

Unless otherwise noted, T

o

C, 4.5V

≤ V

All voltage measurements with respect to GND. Device configured as described in Test Conditions. All specifications are for one channel.

Electrical Characteristics

Symbol

Parameter

Test Conditions

Min

Typ

Max

Units

High input voltage

4.5V

2.5

V

Low input voltage

4.5V

0.8

V

Input voltage range

-5

V

Input current

0V

-10

10

µA

High output voltage

V

Low output voltage

0.025

V

Output resistance

@ Output High

2

2.5

Ω

Output resistance

@ Output Low

1.5

2

Ω

Peak output current

4

A

Continuous output

current

1

A

Rise time

16

18

ns

Fall time

13

17

ns

On-time propagation

delay

36

40

ns

Off-time propagation

delay

35

39

ns

Power supply voltage

4.5

18

35

V

Power supply current

1

0

3

10

10

mA

µA

µA

Parameter

Value

Supply Voltage

40V

All Other Pins

-0.3V to VCC + 0.3V

Junction Temperature

150oC

Storage Temperature

-65oC to 150oC

Soldering Lead Temperature

(10 seconds maximum)

300oC

Operating Ratings

Specifications Subject To Change Without Notice

Note 1: Operating the device beyond parameters with listed “Absolute Maximum Ratings” may cause permanent

damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not

guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed.

Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

Thermal Resistance (To Ambient)

8 Pin PDIP (PI) (

θ

120 K/W

8 Pin SOIC (SIA)

110 K/W

16 Pin SOIC (SIA-16) (

θ

110 K/W

θ

8 Pin SOIC

95 K/W

16 Pin SOIC-CT

95 K/W

Heat sink area of 3 cm

2

8 Pin SOIC

85 K/W

16 Pin SOIC-CT

85 K/W

copper on 1 side of 0.06" thick FR4 PC board.

Parameter

Value

Operating Temperature Range

-55 oC to 125 oC

Thermal Resistance (Junction to Case)

8 Pin SOIC (SI)

16 Pin SOIC (SI-16)

10 K/W

10 K/W