ISSUE

2 - DECEMBER 2006

ZXT12P40DX

THERMAL RESISTANCE

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient (a)(d)

143

°C/W

Junction to Ambient (b)(d)

100

°C/W

Junction to Ambient (a)(e)

120

°C/W

NOTES

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,

in still air conditions

(b) For a device surface mounted on FR4 PCB measured at t 5 secs.

(c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal

Impedance graph.

(d) For device with one active die.

(e) For device with two active die running at equal power.

2

ABSOLUTE MAXIMUM RATINGS.

PARAMETER

SYMBOL

LIMIT

UNIT

Collector-Base Voltage

-50

V

Collector-Emitter Voltage

-40

V

Emitter-Base Voltage

-7.5

V

Peak Pulse Current

-5

A

Continuous Collector Current

-2

A

Base Current

-500

mA

Power Dissipation at TA=25°C (a)(d)

Linear Derating Factor

0.87

6.9

W

mW/°C

Power Dissipation at TA=25°C (a)(e)

Linear Derating Factor

1.04

8.3

W

mW/°C

Power Dissipation at TA=25°C (b)(d)

Linear Derating Factor

1.25

10

W

mW/°C

Operating and Storage Temperature Range

-55 to +150

°C