ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243

2. Specifications

FN4805 Rev.23.00

Page 9 of 36

Apr.26.19

2.

Specifications

2.1

Absolute Maximum Ratings

2.2

Thermal Information

Parameter

Minimum

Maximum

Unit

VCC to Ground

-0.3

6

V

V+ to Ground

-0.3

7

V

V- to Ground

+0.3

-7

V

V+ to V-

14

V

Input Voltages

TIN, FORCEOFF, FORCEON, EN, SHDN

-0.3

6

V

RIN

±25

V

Output Voltages

TOUT

±13.2

V

ROUT, INVALID

-0.3

VCC +0.3

V

Short-Circuit Duration

TOUT

Continuous

ESD Rating

(See ESD Performance)

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely

impact product reliability and result in failures not covered by warranty.

Thermal Resistance (Typical, Note 4)

θJA (°C/W)

16 Ld PDIP Package (Note 5)90

16 Ld Wide SOIC Package

100

16 Ld Narrow SOIC Package

115

18 Ld SOIC Package

75

28 Ld SOIC Package

75

16 Ld SSOP Package

135

20 Ld SSOP Package

122

16 Ld TSSOP Package

145

20 Ld TSSOP Package

140

28 Ld SSOP and TSSOP Packages

100

Notes:

4. θJA is measured with the component mounted on a low-effective thermal conductivity test board in free air. See TB379.

5. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing

applications.

Parameter

Minimum

Maximum

Unit

Maximum Junction Temperature (Plastic Package)

+150

°C

Maximum Storage Temperature Range

-65

+150

°C

Pb-Free Reflow Profile (SOIC, SSOP, TSSOP Only)

see TB493