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AP40H03DF2 数据表(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP40H03DF2 数据表(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 7 page ![]() AP40H03DF2 30V N+N-Channel Enhancement Mode MOSFET AP40H03DF2 REV1.0 永源微電子科技有限公司 Electrical Characteristics (TJ=25 ℃, unless otherwise noted) Symbol Parameter Conditions Min. Typ. Max. Unit BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 30 33 --- V VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.2 1.6 2.5 V RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=30A --- 7.8 10 mΩ VGS=4.5V , ID=15A --- 11 18 IDSS Drain-Source Leakage Current VDS=24V , VGS=0V , TJ=25 ℃ --- --- 1 uA VDS=24V , VGS=0V , TJ=55 ℃ --- --- 5 IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- --- ±100 nA gfs Forward Transconductance VDS=5V , ID=30A --- 34 --- S Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 1.8 --- Ω Qg Total Gate Charge (4.5V) VDS=15V, VGS=4.5V , ID=15A --- 9.8 --- nC Qgs Gate-Source Charge --- 4.2 --- Qgd Gate-Drain Charge --- 3.6 --- Td(on) Turn-On Delay Time VDD=15V , VGS=10V , RG=3.3Ω ID=15A --- 4 --- ns Tr Rise Time --- 8 --- Td(off) Turn-Off Delay Time --- 31 --- Tf Fall Time --- 4 --- Ciss Input Capacitance VDS=15V , VGS=0V , f=1MHz --- 940 --- pF Coss Output Capacitance --- 131 --- Crss Reverse Transfer Capacitance --- 109 --- IS Continuous Source Current1,5 VG=VD=0V , Force Current --- --- 43 A ISM Pulsed Source Current2,5 --- --- 112 A VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 ℃ --- --- 1 V trr Reverse Recovery Time IF=30A , dI/dt=100A/µs , TJ=25 ℃ --- 8.5 --- nS Qrr Reverse Recovery Charge --- 2.2 --- nC Note : 1 、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 2 、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3 、The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1Mh,IAS=28A 4 、The power dissipation is limited by 175℃ junction temperature 5 、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation. |
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