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8

Document Number 83795

Rev. 1.2, 04-Sep-06

TCND5000

Vishay Semiconductors

Precautions For Use

1. Over-current-proof

Customer must apply resistors for protection, other-

wise slight voltage shift will cause big current change

(Burn out will happen).

2. Storage

2.1 Storage temperature and rel. humidity conditions

are: 5 °C to 30 °C, R.H. 60 %

2.2 Floor life must not exceed 72 h, acc. to JEDEC

level 4, J-STD-020.

Once the package is opened, the products should be

used within 72 h. Otherwise, they should be kept in a

damp proof box with desiccant.

Considering tape life, we suggest to use products

within one year from production date.

2.3 If opened more than 72 h in an atmosphere 5 °C

to 30 °C, R.H. 60 %, devices should be treated at

60 °C ± 5 °C for 15 hrs.

2.4 If humidity indicator in the package shows pink

color (normal blue), then devices should be treated

with the same conditions as 2.3

Reflow Solder Profiles

Figure 14. Lead (Pb)-Free Reflow Solder Profile

Figure 15. Lead Tin (SnPb) Reflow Solder Profile

300

250

200

150

100

50

0

0

max. 20 s

max. 120 s

max. 100 s

255 °C

240 °C

217 °C

max. 260 °C

245 °C

max. Ramp up 3°C/s

max. Ramp down 6°C/s

Time (s)

19003

300

250

200

150

100

50

max. 160 °C

full line

: typical

dotted

:process limits

Time (s)

Lead Temperature

90s - 120s

300

250

200

150

100

50

0

0

max. 240 °C

ca. 230 °C

10s

215 °C

max 40s

2 K/s - 4 K/s

948625

250

200

150

100

50