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SW1 数据表(PDF) 1 Page - Molex Electronics Ltd.

部件名 SW1
功能描述  SW1 High-Current Wire-to-Board and Busbar Interconnects
PDF  3 Pages
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制造商  MOLEX [Molex Electronics Ltd.]
网页  http://www.molex.com
标志 MOLEX - Molex Electronics Ltd.

SW1 数据表(HTML) 1 Page - Molex Electronics Ltd.

  SW1 Datasheet HTML 1Page - Molex Electronics Ltd. SW1 Datasheet HTML 2Page - Molex Electronics Ltd. SW1 Datasheet HTML 3Page - Molex Electronics Ltd.  
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DATASHEET
SW1 Wire-to-Board/Wire-to-Busbar Interconnects incorporate
COEUR socket technology which enables a high-current-carrying
capacity in three sizes: 6.00mm (120.0A), 8.00mm (185.0A) and
11.00mm (300.0A) with a unique positive-locking design for
secure mating.
FEATURES AND ADVANTAGES
Positive-locking
stainless steel spring clips
Help secure mating to prevent
cable assemblies from backing
off pins due to shock, vibration
or mishandling; stainless steel
spring clips retract when
pressed and engage once the
pressure is released to lock
into groove on pin
Multiple contact
beams with optimal
current-carrying
capacity
Provides low contact
resistance, low voltage
drop, and minimal heat
generation at the
contact interface
Color-coded receptacle housings
Help to differentiate circuits and to
prevent mis-mating when multiple
cable assemblies are used on the same
application
SW1 High-Current
Wire-to-Board and Busbar
Interconnects
SW1 Cable Assembly and Locking Pin
Compact Design
Offers significantly lower height and significantly shorter length than
competitor’s 8.00mm size receptacle assemblies, resulting in a connector
that is better suited for applications requiring tight spaces.
Housing
PBT
Voltages
1,000V
Currents
120.0A (6.00mm), 185.0A (8.00mm) and 300.0A (11.00mm)
Operating temperatures
-40 to +125°C
Mating Forces
50N (6.00mm), 60N (8.00mm) and 70N (11.00mm)


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