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MMU01020Z3JB2 数据表(PDF) 11 Page - Vishay Siliconix |
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MMU01020Z3JB2 数据表(HTML) 11 Page - Vishay Siliconix |
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11 / 13 page ![]() MMU 0102, MMA 0204, MMB 0207 - Professional www.vishay.com Vishay Beyschlag Revision: 20-Jan-2026 11 Document Number: 28713 For technical questions, contact: melf@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) Special requirements apply to MICRO-MELF, MMU 0102: • R < 100 Ω: ± (0.25 % R + 10 mΩ) • 100 Ω ≤ R ≤ 221 kΩ: ± 0.1 % R • 221 k Ω < R: ± 0.25 % R 8.5 - Electrostatic discharge (Human Body Model) IEC 61340-3-1 (1); 3 pos. + 3 neg. discharges MMU 0102: 1.5 kV MMA 0204: 2 kV MMB 0207: 4 kV ± (0.5 % R + 0.05 Ω) 11.1 58 (Td) Solderability Solder bath method; SnPb40; non-activated flux; (215 ± 3) °C; (3 ± 0.3) s Good tinning ( ≥ 95 % covered); no visible damage Solder bath method; SnAg3Cu0.5 or SnAg3.5; non-activated flux; (235 ± 3) °C; (2 ± 0.2) s Good tinning ( ≥ 95 % covered); no visible damage 11.2 58 (Td) Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s ± (0.05 % R + 10 m Ω) ± (0.1 % R + 10 m Ω) ± (0.25 % R + 10 m Ω) ± (0.25 % R + 10 m Ω) Reflow method 2 (IR/forced gas convection); (260 ± 5) °C; (10 ± 1) s ± (0.02 % R + 10 m Ω) ± (0.05 % R + 10 m Ω) ± (0.05 % R + 10 m Ω) ± (0.1 % R + 10 m Ω) 11.3 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage Solvent resistance of marking Isopropyl alcohol; 50 °C; method 1, toothbrush Marking legible; no visible damage 9.7 21 (Ue3) Shear (adhesion) 45 N No visible damage 9.8 21 (Ue1) Substrate bending Depth 2 mm, 3 times No visible damage, no open circuit in bent position ± (0.05 % R + 5 mΩ) (2) 12.2 - Voltage proof URMS = Uins; 60 s No flashover or breakdown 12.4 - Flammability IEC 60695-11-5 (1), needle flame test; 10 s No burning after 30 s TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 (1) TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE ( ΔR) Stability for product types: STABILITY CLASS 0.25 OR BETTER STABILITY CLASS 0.5 OR BETTER STABILITY CLASS 1 OR BETTER STABILITY CLASS 2 OR BETTER MMU 0102 10 Ω to 221 kΩ 1 Ω to < 10 Ω < 1 Ω > 221 k Ω MMA 0204 10 Ω to 332 kΩ 1 Ω to < 10 Ω < 1 Ω > 332 k Ω MMB 0207 10 Ω to 1 MΩ 1 Ω to < 10 Ω < 1 Ω > 1 M Ω |
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