D2TO20

www.vishay.com

Vishay Sfernice

Revision: 17-Mar-16

2

Document Number: 51055

For technical questions, contact: sferfixedresistors@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

SPECIAL FEATURES

Resistance Values

 0.010

 0.045

0.1

 0.5

Tolerances

± 1 % at ± 10 %

Requirement Temperature Coefficient (TCR)



(-55 °C +150 °C)



IEC 60115-1

± 1100 ppm/°C

± 700 ppm/°C

± 250 ppm/°C

± 150 ppm/°C

PERFORMANCE

TESTS

CONDITIONS

REQUIREMENTS

Momentary Overload

IEC 60115-1 §4.13

2 Pr 5 s for R < 2



1.5 Pr 5 s for R

 2 

US < 1.5 UL

± (0.25 % + 0.005

)

Load Life

IEC 60115-1

1000 h, 90/30 Pr at +25 °C

± (1 % + 0.005

)

High Temperature Exposure

AEC-Q200 REV D conditions:

MIL-STD-202 method 108

1000 h, +175 °C, unpowered

± (0.25 % + 0.005

)

Temperature Cycling

Pre-conditioning 3 reflows according

JESTD020D

IEC 60068-2-14 test Na

1000 cycles, -55 °C/+175 °C

Dwell time - 15 min

± (0.5 % + 0.005

)

Moisture Resistance

AEC-Q200 REV D conditions:

MIL-STD-202 method 106

10 cycles, 24 h, unpowered

± (0.5 % + 0.005

)

Biased Humidity

AEC-Q200 REV D conditions:

MIL-STD-202 method 103

1000 h, 85°C, 85 % RH

± (1 % + 0.005

)

Operational Life

AEC-Q200 REV D conditions:

Pre-conditioning 3 reflows according

JESTD020D

MIL-STD-202 method 108

2000 h, 90/30, powered, +125 °C

± (1 % + 0.005

)

ESD Human Body Model

AEC-Q200 REV D conditions:

AEC-Q200-002

25 kVAD

± (0.5 % + 0.005

)

Vibration

AEC-Q200 REV D conditions:

MIL-STD-202 method 204

5 g’s for 20 min, 12 cycles

test from 10 Hz to 2000 Hz

± (0.5 % + 0.005

)

Mechanical Shock

AEC-Q200 REV D conditions:

MIL-STD-202 method 213

100 g’s, 6 ms, 3.75 m/s

3 shocks/direction

± (0.5 % + 0.005

)

Board Flex

AEC-Q200 REV D conditions:

AEC-Q200-005

Bending 2 mm/60 s

± (0.25 % + 0.01

)

Terminal Strength

AEC-Q200 REV D conditions:

AEC-Q200-006

1.8 kgf/60 s

± (0.25 % + 0.01

)

ASSEMBLY SPECIFICATIONS

For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C

TESTS

CONDITIONS

REQUIREMENTS

Resistance to Soldering Heat

IEC 60115-1

IEC 60068-2-58

Solder bath method: 270 °C/10 s

± (0.5 % + 0.005

)

Moisture Sensitivity Level (MSL)

IPC/JEDEC® J-STD-020C

85 °C/85 % RH/168 h

Level: 1

+ pass requirements of TCR

overload and dielectric strength after MSL