NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

4. Features may differ or may not be present

PACKAGE OUTLINE

4224640/B 01/2026

www.ti.com

WQFN - 0.8 mm max height

PLASTIC QUAD FLAT PACK-NO LEAD

BQB0016A

A

0.08 C

0.1

C A B

0.05

C

B

SYMM

SYMM

PIN 1 INDEX AREA

2.6

2.4

3.6

3.4

0.8

0.7

0.05

0.00

SEATING PLANE

C

1.1

0.9

2.1

1.9

2X 0.5

16X 0.30

0.18

16X 0.5

0.3

2X

2.5

10X 0.5

PIN 1 ID

(OPTIONAL)

(0.2) TYP

1

2

7

8

9

10

15

16

(0.16)

(0.15) TYP

NOTE 4

(0.23)