X9C102, X9C103, X9C104, X9C503

FN8222 Rev 4.00

Page 2 of 12

Jan 11, 2019

Ordering Information

PART

NUMBER

PART

MARKING

RTOTAL

(k

)

TEMP RANGE

(°C)

PACKAGE

(RoHS Compliant)

PACKAGE

DWG. #

X9C102PZ (Notes 2, 3)

X9C102P Z

1

0 to +70

8 Ld PDIP

MDP0031

X9C102PIZ (Notes 2, 3)

X9C102P ZI

-40 to +85

8 Ld PDIP

MDP0031

X9C102SZ (Notes 1, 2)

X9C102S Z

0 to +70

8 Ld SOIC

M8.15E

X9C102SIZ (Notes 1, 2)

X9C102S ZI

-40 to +85

8 Ld SOIC

M8.15E

X9C103PZ (Notes 2, 3)

X9C103P Z

10

0 to +70

8 Ld PDIP

MDP0031

X9C103PIZ (Notes 2, 3)

X9C103P ZI

-40 to +85

8 Ld PDIP

MDP0031

X9C103SZ (Notes 1, 2)

X9C103S Z

0 to +70

8 Ld SOIC

M8.15

X9C103SIZ (Notes 1, 2)

X9C103S ZI

-40 to +85

8 Ld SOIC

M8.15

X9C503PZ (Notes 2, 3)

X9C503P Z

50

0 to +70

8 Ld PDIP

MDP0031

X9C503PIZ (Notes 2, 3)

X9C503P ZI

-40 to +85

8 Ld PDIP

MDP0031

X9C503SZ (Notes 1, 2)

X9C503S Z

0 to +70

8 Ld SOIC

M8.15E

X9C503SIZ (Notes 1, 2)

X9C503S ZI

-40 to +85

8 Ld SOIC

M8.15E

X9C104PIZ (Notes 2, 3)

X9C104P ZI

100

-40 to +85

8 Ld PDIP

MDP0031

X9C104SZ (Notes 1, 2)

X9C104S Z

0 to +70

8 Ld SOIC

M8.15E

X9C104SIZ (Notes 1, 2)

X9C104S ZI

-40 to +85

8 Ld SOIC

M8.15E

NOTES:

1. Add “T1” suffix for tape and reel. See TB347 for details about reel specifications.

2. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin

plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Pb-free

products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications.