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LMC7215IM 数据表(PDF) 3 Page - National Semiconductor (TI) |
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LMC7215IM 数据表(HTML) 3 Page - National Semiconductor (TI) |
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3 / 11 page ![]() 2.7V to 5V Electrical Characteristics (Continued) Unless otherwise specified, all limits guaranteed for T J = 25˚C, V + = 2.7V to 5V, V− = 0V, V CM =VO =V +/2. Boldface limits apply at the temperature extremes. Typ LMC7215 LMC7225 Symbol Parameter Conditions (Note 5) Limit Limit Units (Note 6) (Note 6) Current (Note 10) V + = 5.0V, Sourcing 50 NA mA I SC− Output Short Circuit V + = 2.7V, Sinking 12 mA Current (Note 10) V + = 5.0V, Sinking 30 mA I Leakage Output Leakage Current V + = 2.2V nA V IN+ = 0.1V, VIN− = 0V, 0.01 NA 500 max V OUT = 15V I S Supply Current V + = 5.0V 0.7 1 1 µA V IN+ = 5V, VIN−=0V 1.2 1.2 max AC Electrical Characteristics Unless otherwise specified, T J = 25˚C, V + = 5V, V− = 0V, V CM =V +/2 LMC7215 LMC7225 Symbol Parameter Conditions Typ Typ Units (Note 5) (Notes 5, 8) t rise Rise Time Overdrive = 10 mV (Note 8) 1 12.2 µs t fall Fall Time Overdrive = 10 mV (Note 8) 0.4 0.35 µs t PHL Propagation Delay (Notes 8, 9) Overdrive = 10 mV 24 24 µs (High to Low) Overdrive = 100 mV 12 12 V + = 2.7V Overdrive = 10 mV 17 17 µs (Notes 8, 9) Overdrive = 100 mV 11 11 t PLH Propagation Delay (Notes 8, 9) Overdrive = 10 mV 24 29 µs (Low to High) Overdrive = 100 mV 12 17 V + = 2.7V Overdrive = 10 mV 17 22 µs (Notes 8, 9) Overdrive = 100 mV 11 16 Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C. Note 4: The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD =(TJ(MAX) −TA)/θJA. All numbers apply for packages soldered directly into a PC board. Note 5: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material. Note 6: All limits are guaranteed by testing or statistical analysis. Note 7: CMRR measured at VCM = 0V to 2.5V and 2.5V to 5V when VS =5V, VCM = 0.2V to 1.35V and 1.35V to 2.7V when VS = 2.7V. This eliminates units that have large VOS at the VCM extremes and low or opposite VOS at VCM =VS/2. Note 8: All measurements made at 10 kHz. A 100 k Ω pull-up resistor was used when measuring the LMC7225. CLOAD = 50 pF including the test jig and scope probe. The rise times of the LMC7225 are a function of the R-C time constant. Note 9: Input step voltage for the propagation measurements is 100 mV. Note 10: Do not short the output of the LMC7225 to voltages greater than 10V or damage may occur. www.national.com 3 |
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