M40Z111, M40Z111W

4/15

Figure 4. Hardware Hookup

MAXIMUM RATING

Stressing the deviceabove therating listedinthe

“Absolute Maximum Ratings” table may cause

permanent damage to the device. These are

stress ratings only and operation of the device at

these or any other conditions above those indicat-

ed in the Operating sections of this specification is

not implied. Exposure to Absolute Maximum Rat-

ing conditions for extended periods may affect de-

vice

reliability.

Refer

also

to

the

STMicroelectronics SURE Program and other rel-

evant quality documents.

Table 2. Absolute Maximum Ratings

Note: 1. Reflow at peak temperature of 215°C to 225°C for < 60 seconds (total thermal budget not to exceed 180°C for between 90 to 120

seconds).

CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode.

CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.

AI02394

VCC

E

E2

ECON

VSS

VOUT

VCC

CMOS

SRAM

x8 or x16

3.0, 3.3, or 5V

THS

E

0.1

µF

0.1

µF

M40Z111/W

Thereshold

1N5817 or

MBR5120T3

Symbol

Parameter

Value

Unit

Ambient Operating Temperature

Grade 6

–40 to 85

°C

–40 to 85

°C

SOIC

–55 to 125

°C

(1)

Lead Solder Temperature for 10 seconds

260

°C

Input or Output Voltages

V

Supply Voltage

M40Z111

–0.3 to 7.0

V

M40Z111W

–0.3 to 4.6

V

Output Current

20

mA

Power Dissipation

1

W