TLC080_08 datasheet(23/51 Pages) TI

23 / 51 page

TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA

FAMILY OF WIDEBANDWIDTH HIGHOUTPUT DRIVE SINGLE SUPPLY

OPERATIONAL AMPLIFIERS

SLOS254E − JUNE 1999 − REVISED APRIL 2006

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APPLICATION INFORMATION

general PowerPAD design considerations (continued)

The PowerPAD must be connected to the most negative supply voltage (GND pin potential) of the device.

Prepare the PCB with a top side etch pattern (see the landing patterns at the end of this data sheet). There

should be etch for the leads as well as etch for the thermal pad.

Place five holes (dual) or nine holes (quad) in the area of the thermal pad. These holes should be 13 mils

in diameter. Keep them small so that solder wicking through the holes is not a problem during reflow.

Additional vias may be placed anywhere along the thermal plane outside of the thermal pad area. This helps

dissipate the heat generated by the TLC08x IC. These additional vias may be larger than the 13-mil

diameter vias directly under the thermal pad. They can be larger because they are not in the thermal pad

area to be soldered so that wicking is not a problem.

Connect all holes to the internal plane that is at the same potential as the ground pin of the device.

When connecting these holes to this internal plane, do not use the typical web or spoke via connection

methodology. Web connections have a high thermal resistance connection that is useful for slowing the heat

transfer during soldering operations. This makes the soldering of vias that have plane connections easier.

In this application, however, low thermal resistance is desired for the most efficient heat transfer. Therefore,

the holes under the TLC08x PowerPAD package should make their connection to the internal ground plane

with a complete connection around the entire circumference of the plated-through hole.

The top-side solder mask should leave the terminals of the package and the thermal pad area with its five

holes (dual) or nine holes (quad) exposed. The bottom-side solder mask should cover the five or nine holes

of the thermal pad area. This prevents solder from being pulled away from the thermal pad area during the

reflow process.

Apply solder paste to the exposed thermal pad area and all of the IC terminals.

With these preparatory steps in place, the TLC08x IC is simply placed in position and run through the solder

reflow operation as any standard surface-mount component. This results in a part that is properly installed.

For a given

θJA, the maximum power dissipation is shown in Figure 53 and is calculated by the following formula:

D +

MAX

–T

Where:

= Maximum power dissipation of TLC08x IC (watts)

TMAX = Absolute maximum junction temperature (150°C)

= Free-ambient air temperature (

°C)

θJA = θJC + θCA

θJC = Thermal coefficient from junction to case

θCA = Thermal coefficient from case to ambient air (°C/W)

TLC080 数据表(PDF) 23 Page - Texas Instruments

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