M48Z128, M48Z128Y

2/17

Figure 2. DIP Connections

A1

A0

DQ0

A7

A4

A3

A2

A6

A5

A13

A10

A8

A9

DQ7

A15

A11

G

E

DQ5

DQ1

DQ2

DQ3

VSS

DQ4

DQ6

A16

NC

VCC

AI01195

M48Z128

M48Z128Y

10

1

2

5

6

7

8

9

11

12

13

14

15

16

30

29

26

25

24

23

22

21

20

19

18

17

A12

A14

W

NC

3

4

28

27

32

31

Note: 1. Stresses greater than those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or any other conditions above those indicated in the operational section

of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may affect

reliability.

2. Soldering temperature not to exceed 260

°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).

CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode.

Table 3. Operating Modes

Symbol

Parameter

Value

Unit

Ambient Operating Temperature

0 to 70

°C

–40 to 70

°C

Temperature Under Bias

–10 to 70

°C

(2)

Lead Solder Temperature for 10 seconds

260

°C

Input or Output Voltages

–0.3 to 7

V

Supply Voltage

–0.3 to 7

V

Mode

E

G

W

DQ0-DQ7

Power

Deselect

4.75V to 5.5V

or

4.5V to 5.5V

X

X

High Z

Standby

Write

X

Active

Read

Active

Read

High Z

Active

Deselect

X

X

X

High Z

CMOS Standby

Deselect

X

X

X

High Z

Battery Back-up Mode

DESCRIPTION

128 Kbit x8 non-volatile static RAM that integrates

power-fail deselect circuitry and battery control

logic on a single die. The monolithic chip is avail-

able in two special packages to provide a highly in-

tegrated battery backed-up memory solution.

The M48Z128/128Y is a non-volatile pin and func-

tion equivalent to any JEDEC standard 128K x8

SRAM. It also easily fits into many ROM, EPROM,

and EEPROM sockets, providing the non-volatility

of PROMs without any requirement for special

write timing or limitations on the number of writes

that can be performed. The 32 pin 600mil DIP

Module houses the M48Z128/128Y silicon with a

long life lithium button cell in a single package.

For surface mount environments ST provides a Chip

Set solution consisting of a 28 pin 330mil SOIC

NVRAM Supervisor (M40Z300) and a 32 pin TSOP

(8 x 20mm) LPSRAM (M68Z128) packages.

The 28 pin 330mil SOIC provides sockets with

gold plated contacts at both ends for direct con-

nection to a separate SNAPHAT housing contain-

ing the battery.