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AM261...ZEJ 数据表(PDF) 210 Page - Texas Instruments |
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AM261...ZEJ 数据表(HTML) 210 Page - Texas Instruments |
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210 / 218 page  PACKAGE OPTION ADDENDUM www.ti.com 18-Jun-2026 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) AM2612AODFHIZNCR Active Production NFBGA (ZNC) | 293 184 | JEDEC TRAY (5+1) Yes SNAGCU Level-3-260C-168 HR -40 to 125 AM261 2AODFHIZNCR 508 AM2612AOEFHIZFGR Active Production NFBGA (ZFG) | 304 1000 | LARGE T&R Yes SNAGCU Level-3-260C-168 HR -40 to 125 AM261 2AOEFHIZFGR 508 AM2612AOEFHIZNCR Active Production NFBGA (ZNC) | 293 184 | JEDEC TRAY (5+1) Yes SNAGCU Level-3-260C-168 HR -40 to 125 AM261 2AOEFHIZNCR 508 AM2612AOFFHIZEJR Active Production NFBGA (ZEJ) | 256 1000 | LARGE T&R Yes SNAGCU Level-3-260C-168 HR -40 to 125 AM261 2AOFFHIZEJR 508 AM2612AOFFHIZFGR Active Production NFBGA (ZFG) | 304 1000 | LARGE T&R Yes SNAGCU Level-3-260C-168 HR -40 to 125 AM261 2AOFFHIZFG 508 AM2612AOFFHIZNCR Active Production NFBGA (ZNC) | 293 1000 | JEDEC TRAY (5+1) Yes SNAGCU Level-3-260C-168 HR -40 to 125 AM261 2AOFFHIZNCR 508 AM2612AOFFHMZCZR Active Production NFBGA (ZCZ) | 324 1000 | LARGE T&R Yes SNAGCU Level-3-260C-168 HR -40 to 125 AM261 2AOFFHMZCZR 508 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. Addendum-Page 2 |
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