6.4 Thermal Information

THERMAL METRIC(1)

REF50xxEI

REF50xxI , REF50xxAI

UNIT

D (SOIC)

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

120

115

160.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

52

63.4

53.9

°C/W

RθJB

Junction-to-board thermal resistance

66

57.1

82.9

°C/W

ΨJT

Junction-to-top characterization parameter

9.8

15.4

5.1

°C/W

ΨJB

Junction-to-board characterization parameter

64.7

56.2

80.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

REF50, REF50E

SBOS410O – JUNE 2007 – REVISED OCTOBER 2025

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