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L5961PD 数据表(PDF) 4 Page - STMicroelectronics |
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L5961PD 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 7 page ![]() Package information L5961 4/7 3 Package information In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 2. PowerSSO-36 mechanical data and package dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 2.15 2.47 0.084 0.097 A2 2.15 2.40 0.084 0.094 a1 0 0.075 0 0.003 b 0.18 0.36 0.007 0.014 c 0.23 0.32 0.009 0.012 D (1) 10.10 10.50 0.398 0.413 E (1) 7.4 7.6 0.291 0.299 e 0.5 0.019 e3 8.5 0.335 F 2.3 0.090 G 0.10 0.004 G1 0.06 0.002 H 10.10 10.50 0.398 0.413 h 0.40 0.016 k5˚ 5˚ L 0.55 0.90 0.022 0.035 M 4.3 0.169 N 10˚ 10˚ O 1.2 0.047 Q 0.8 0.031 S 2.9 0.114 T3.65 0.144 U 1.0 0.039 X 4.1 4.7 0.161 0.185 Y 6.5 7.3 0.256 0.287 (1) "D” and “E" do not include mold flash or protrusions Mold flash or protrusions shall not exceed 0.15 mm per side(0.006”) PowerSSO-36 7587131 A (exposed pad) G LEAD COPLANARITY BOTTOM VIEW D e3 0.1 A M B b e A Y T L hx45 U O B |
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