Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

LM4041DIDBZT

ACTIVE

SOT-23

DBZ

3

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

LM4041DIDBZTG4

ACTIVE

SOT-23

DBZ

3

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

LM4041DIDCKR

ACTIVE

SC70

DCK

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

LM4041DIDCKRE4

ACTIVE

SC70

DCK

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

LM4041DIDCKRG4

ACTIVE

SC70

DCK

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

LM4041DIDCKT

ACTIVE

SC70

DCK

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

LM4041DIDCKTE4

ACTIVE

SC70

DCK

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

LM4041DIDCKTG4

ACTIVE

SC70

DCK

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

LM4041DILP

ACTIVE

TO-92

LP

3

1000

Pb-Free

(RoHS)

CU SN

N / A for Pkg Type

LM4041DILPE3

ACTIVE

TO-92

LP

3

1000

Pb-Free

(RoHS)

CU SN

N / A for Pkg Type

LM4041DILPR

ACTIVE

TO-92

LP

3

2000

Pb-Free

(RoHS)

CU SN

N / A for Pkg Type

LM4041DILPRE3

ACTIVE

TO-92

LP

3

2000

Pb-Free

(RoHS)

CU SN

N / A for Pkg Type

LM4041DQDBZR

ACTIVE

SOT-23

DBZ

3

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

LM4041DQDBZRG4

ACTIVE

SOT-23

DBZ

3

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

LM4041DQDBZT

ACTIVE

SOT-23

DBZ

3

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

LM4041DQDBZTG4

ACTIVE

SOT-23

DBZ

3

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

PACKAGE OPTION ADDENDUM

www.ti.com

24-Mar-2008

Addendum-Page 4