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ACT1X5 数据表(PDF) 1 Page - Advanced Crystal Technology

部件名 ACT1X5
功能描述  Watch Crystal
PDF  1 Pages
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制造商  ACT [Advanced Crystal Technology]
网页  http://www.actcrystals.com
标志 ACT - Advanced Crystal Technology

ACT1X5 数据表(HTML) 1 Page - Advanced Crystal Technology

  ACT1X5 Datasheet HTML 1Page - Advanced Crystal Technology  
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Customer To specify : Frequency Tolerance, Load Capacitance, Operating Temperature Range
In line with our ongoing policy of product evolvement and improvement, the above specification may be subject to change without notice
http://www.actcrystals.com
ISO9001:2000 Registered
For quotations or further information please contact us at:
3 The Business Centre, Molly Millars Lane, Wokingham, Berkshire, RG41 2EY, UK
Specification
Please note that all parameters can not necessarily be specified in the same device
The ACT1x5, 2x6 & 3x8 are miniature cylindrical packages offering high vibration and shock resistance,
together with high stability. They are suitable for portable equipment and where a close packing density is
required.Two versions are offered, C1BLC: a low cost version and the HQM4E: a version with a higher Q
value. The 1x5 device is only available in the High Q version.
Tel :
0044 (0)118 979 1238
Fax :
0044 (0)118 979 1283
email :
info@actcrystals.com
ACT1x5, 2x6 & 3x8 Watch Crystal
Issue : 7C1b/M4E
Date :03-10-07
Nominal Frequency
fo
3x8
2x6
1x5
2x6
3x8
Quality Factor ( Typical)
Q
60,000
50,000
85,000
70,000
85,000
Shunt Capacitance (Typical)
C0
1.8pF
1.45pF
1.0pF
1.35pF
1.6pF
Equivalent Series Resistance
ESR
30K
Ω max
35K
Ω max
40K
Ω max
Motional Capacitance ( Typical)
C1
0.0030pF
0.0028pF
0.0024pF
Frequency Tolerance @25°C
Δf/fo
±20 standard
Load Capacitance
CL
12.5pF
Frequency v Temperature
Δf/t
amb
Turnover Temperature
Tm
Temperature Coefficient
β
Temp Operating Range
Topr
Temp Storage Range
Tstg
Drive Level
DL
Insulation Resistance
IR
Aging
Δf/yr
Shock Resistance
Δf/
shock
-40 ~ +85°C
Parameter
HQM4E Series
Outline
32.768KHz
Specification
Specification
C1bLC Series
±20ppm standard ±5, ±10ppm
options )
See Drawing -40 °C +85°C
6pF~12.5pF(6, 12.5pF standard
35K
Ω max
0.0024pF
12.5, 6.0pF
See Drawing (-40 °C +85°C)
+/-3ppm(25°C 1st year)
1
μ W max
500M
Ω / 100VDC min
-0.034+/-0.006ppm / °C
2
-20 +70°C ,( -40 +85°C option )
-40~+85°C
±5ppm First year, 25°C (±3ppm
option)
±20ppm standard (2x6 &
3x8: ±5 & ±10ppm options)
±5ppm
±5ppm
1
μ W max
500M
Ω / 100VDC min
25°C ±5°C
25°C ±5°C
-0.035±0.0086ppm / °C
2
-10 +60°C standard ,
( -20~+70, -40 +85°C Options)
Soldering
Lead wires should be soldered within 10
seconds with a tip temperature not exceeding
270°C.
The device should ideally be upright on the
board.
If the device can is required to be mechanically
affixed to the board it should be stuck down
with rubber adhesive.
Under no circumstances should any solder
connection be made to the can of the device.


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