Issue : 1 C1b

Date : 04/07/2006

http://www.actcrystals.com

In line with our ongoing policy of product evolvement and improvement, the above specification may be subject to change without notice.

ISO9001: 2000 Registered

For quotations or further information please contact us at:

3 The Business Centre, Molly Millars Lane, Wokingham, Berks, RG41 2EY, UK

Tel :

0044 (0)118 979 1238

Fax :

0044 (0)118 979 1283

email :

info@actcrystals.com

Soldering of the ACT26SMX

Reflow oven should be set up to emulate the maximum reflow profiles temperatures and times shown in the diagram below. Note it is just as

important to conform to the times specified l as the temperatures.

Pre-heat should not exceed 217°C and rate of heating from 25°C to 217°C should be limited to 4deg C/sec

Peak soldering temperature should not exceed 260°C.

Time at peak temperature should not exceed 10 seconds.

Total reflow time should not exceed 7 minutes.

Should it be required to solder the can to the PCB, then the area and volume of solder should be kept to an absolute minimum, and trials should

be conducted to determine if the re-flow process in use is satisfactory .

Wash Processes for Watch Crystals

Ultrasonic cleaning should be avoided.

Lead Plating:

CuSn

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